NOZZLE CLEANER OF SEMICONDUCTOR ETCHING DEVICE

摘要

A nozzle cleaning device of semiconductor etching equipment is provided to prevent the defects of a wafer due to a powder by improving a port structure of the semiconductor etching equipment so that chemicals do not remain at an end of a nozzle. A wafer is received on an upper surface of a chuck. The chuck rotates the wafer. A nozzle sprays chemicals to the wafer as it moves right and left directions over the wafer. The nozzle stands by at an idle port(3A) during a process stand-by state. A pre-rinse port(2A) sprays the chemicals in the nozzle before the process. A deionized-water supplying unit(20) is formed in the idle port to supply deionized-water to an end of the nozzle. A nitrogen gas supplying unit(30) dries the end of the nozzle. The deionized-water supplying unit and the nitrogen gas supplying unit are also formed in the pre-rinse port. The nozzle moves in right and left directions and the end of the nozzle is contacted to the deionized-water supplying unit and the nitrogen gas supplying unit.