| 摘要 |
A heat dissipation device includes a heat conducting plate ( 100 ) for contacting with an electronic component ( 400 ), a heat sink ( 200 ) mounted on the heat conducting plate and a heat pipe ( 300 ). The heat conducting plate comprises a groove ( 110 ) defined in. The heat pipe comprises an evaporating portion ( 310 ) sandwiched between the heat conducting plate and the heat sink, and a condensing portion ( 320 ) thermally connecting with the heat sink. The evaporating portion comprises a middle portion ( 3104 ) having a circular cross section and accommodated in the groove of the heat conducting plate, and a pair of end portions ( 3102 ) formed on opposite sides of the middle portion. The end portions have flat bottom surfaces.
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