| 摘要 |
A semiconductor component includes an integrated semiconductor chip and a chip housing. The chip housing has first, second, third and fourth conductor tracks that connect input and output connections of the semiconductor chip to external contact connections on the underside and top side of the chip housing in such a way that a loop back interconnection of a plurality of semiconductor components stacked one on top of another is made possible without subsequent structural alterations to the chip housings thereof.
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