发明名称 Charged particle beam irradiation method, method of manufacturing semiconductor device and charged particle beam apparatus
摘要 A charged particle beam irradiation method includes: obtaining shape information of an edge of a pattern to be inspected that is formed on a subject; creating a first line group substantially perpendicular to the pattern edge; creating a second line group substantially parallel with the pattern edge; specifying areas defined by the first line group and the second line group as a lattice group including irradiation positions of a charged particle beam; deciding an order to irradiate the areas with the charged particle beam so that the lattice group is sequentially scanned in a direction of the first or second line group; and scanning the subject with the charged particle beam in accordance with the irradiation order.
申请公布号 US7439503(B2) 申请公布日期 2008.10.21
申请号 US20040959499 申请日期 2004.10.07
申请人 KABUSHIKI KAISHA TOSHIBA 发明人 ABE HIDEAKI
分类号 G21K1/093;H01J37/28;G01N23/225;G21K5/00;G21K5/04;H01J37/147;H01L21/66 主分类号 G21K1/093
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