发明名称 |
Charged particle beam irradiation method, method of manufacturing semiconductor device and charged particle beam apparatus |
摘要 |
A charged particle beam irradiation method includes: obtaining shape information of an edge of a pattern to be inspected that is formed on a subject; creating a first line group substantially perpendicular to the pattern edge; creating a second line group substantially parallel with the pattern edge; specifying areas defined by the first line group and the second line group as a lattice group including irradiation positions of a charged particle beam; deciding an order to irradiate the areas with the charged particle beam so that the lattice group is sequentially scanned in a direction of the first or second line group; and scanning the subject with the charged particle beam in accordance with the irradiation order.
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申请公布号 |
US7439503(B2) |
申请公布日期 |
2008.10.21 |
申请号 |
US20040959499 |
申请日期 |
2004.10.07 |
申请人 |
KABUSHIKI KAISHA TOSHIBA |
发明人 |
ABE HIDEAKI |
分类号 |
G21K1/093;H01J37/28;G01N23/225;G21K5/00;G21K5/04;H01J37/147;H01L21/66 |
主分类号 |
G21K1/093 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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