Curable adhesive composition and its use in the optical field

摘要

The invention concerns a photocurable adhesive composition comprising, based on total weight of photopolymerizable monomers and/or oligomers of the composition: (A1) 20 to 80 wt % of at least one diacrylate monomer or oligomer thereof (A1); (A2) 80 to 20 wt % of at least one dimethacrylate monomer or oligomer thereof; (B) 0 to 50 wt %, of at least one copolymerizable monomer different from components (A1) and (A2); with the proviso that the composition is free from any thio(meth)acrylate (-SCOCR'-CH₂, with R'-H or CH₃) monomer or oligomer thereof.