| 摘要 |
An inverted F-antenna may include an element formed from conductor patterns on a plurality of layers including at least one buried layer of a multilayer PCB, wherein (a) the conductor patterns are in stacked relation and interconnected through the PCB, (b) the conductor patterns comprise an F-shaped conductor pattern on one layer of the PCB and an I-, L- or F-shaped conductor pattern on the or each other layer, and (c) the or each I-, L- or F-shaped conductor pattern comprises an upright substantially coextensive with an upright of the F-shaped conductor pattern. A mobile phone may include such an antenna.
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