发明名称 Intermediate load mechanism for a semiconductor package
摘要 In one embodiment, the present invention includes a load frame to be affixed to a primary surface of a circuit board adjacent to a socket, a load plate having a proximal portion rotatably adapted to the load frame and a distal portion having a tongue member to be locked by a shoulder member adapted to the circuit board on a side of the socket opposite to the frame, and a load lever to mate the load plate to the load frame, where the load lever is rotatable from an open position to an engaged position to lock the tongue member of the load plate under a head of the shoulder member. Other embodiments are described and claimed.
申请公布号 US7438580(B1) 申请公布日期 2008.10.21
申请号 US20070903027 申请日期 2007.09.20
申请人 INTEL CORPORATION 发明人 AOKI RUSSELL;BYQUIST TOD A.;SHIMADA KONOMI
分类号 H01R13/62 主分类号 H01R13/62
代理机构 代理人
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