| 摘要 |
A reactive sputtering apparatus is disclosed having metal cathode units, each of which comprises a cathode element and an electrostatic shield spaced from and surrounding it on all sides except that which is to be presented towards a substrate on to which a coating of a compound of the cathode metal is to be sputtered, the electrostatic shield being formed with spaced inner and outer walls between which the sputtering atmosphere can be fed into the working space between the cathode element and the substrate. The functions of electrostatic shielding and gas supply are thereby separated from one another, so that the spacings of the inner wall from the cathode element, and of the inner wall from the outer wall, can be dimensioned to suit the different functions, and the risk of electrical breakdown can be much reduced. |
