发明名称 PREFORMED EMI/RFI-SHIELDING COMPOSITIONS IN PROFILED FORM AND METHOD OF HOLE HERMETIC SEALING
摘要 FIELD: chemistry. ^ SUBSTANCE: invention relates to preformed compositions in profiled form, having EMI/RFI-shielding ability, and to application of such compositions for hermetic sealing. preformed composition in profiled form is described. It includes basic composition, which includes polysulfide polymer and polytioether polymer and at least one electro-conducting filler, which contains Ni-fibres and nickel-plated graphite, composition of vulcanisating agent, where preformed composition has ability to shield EMI/RFI-radiation, also method of hole hermetic sealing in order to create EMI/RFI-shielding effect is described. ^ EFFECT: creation of preformed composition in profiled form, having ability to ensure efficient EMI/RFI-shielding with minimal corrosion of conducting surfaces in conditions, arising in process of application in fields of aviation and aerospace. ^ 24 cl, 2 tbl, 1 ex
申请公布号 RU2336288(C2) 申请公布日期 2008.10.20
申请号 RU20050137190 申请日期 2004.04.30
申请人 PRK-DESOTO INTERNEHSHNL, INK. 发明人 KOSMAN MAJKL A.;BALLADARES ADRIAN
分类号 C08L81/04;C08K7/06;C08K9/02;C08L81/02 主分类号 C08L81/04
代理机构 代理人
主权项
地址