| 摘要 |
<P>PROBLEM TO BE SOLVED: To easily improve a yield when adjusting the oscillation frequency of an oscillation device. <P>SOLUTION: This manufacturing method of an oscillation device comprises the steps for: overlappingly forming a piezoelectric film made of a piezoelectric material on a first electrode formed on a semiconductor substrate 7, forming a second electrode on the piezoelectric film, facing the first electrode across the piezoelectric film, and forming a first capacitor having the first electrode, the piezoelectric film and the second electrode as a portion of the configuration; mounting the semiconductor substrate 7 in a container 3 with a through hole 61 provided, piercing between the inside and the outside of the container 3 on a third substrate 45 to be the bottom of the container 3 so as to close the through hole 61 with the semiconductor substrate 7 and overlap the first capacitor on the through hole 61 from a planar viewpoint; and closing the through hole 61 from the outside of the container 3 on the basis of a result of measuring an oscillation frequency of the oscillation circuit while pressure P1 is applied into the through hole 61 closed by the semiconductor substrate 7 from the outside of the container 3. <P>COPYRIGHT: (C)2009,JPO&INPIT |
