发明名称 LASER BEAM MACHINING APPARATUS AND MACHINING SYSTEM
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a laser beam machining apparatus and machining system by which detection of abnormality can be properly carried out in accordance with the output intensity of a laser light source. <P>SOLUTION: The apparatus includes: a laser light source 53 for outputting a laser beam; a machining means 51 for machining a workpiece W by irradiating it with a laser beam L from the laser light source 53; a light receiving means 58 for receiving the laser beam L from the laser light source 53; and a first informing means 56 which, if the light receiving level R of the light receiving means 53 falls below a first reference value TH1, outputs a first abnormality signal S2 when a first informing condition concerning, for example, the time of the falling below is fulfilled. <P>COPYRIGHT: (C)2009,JPO&INPIT</p>
申请公布号 JP2008246540(A) 申请公布日期 2008.10.16
申请号 JP20070091599 申请日期 2007.03.30
申请人 SUNX LTD 发明人 KATO DAIKI;MORITA NAOKI
分类号 B23K26/00;B23K26/067 主分类号 B23K26/00
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