发明名称 METHOD OF MANUFACTURING PRINTED WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To provide a method of manufacturing a printed wiring board which can completely remove deposited cutting powder, even on an end face of the printed wiring board. SOLUTION: In a method of manufacturing a printed wiring board with which outer shape machining is performed on a substrate 1, having a wiring pattern so as to obtain the printed wiring board in a predetermined external shape, an insulated resin having a predetermined fusing temperature is contained in the substrate, a slit 10 is formed on the substrate and while making a columnar portion 42 rotate about the axis of the slit, a circumferential surface of the columnar portion is brought into press-contact with an end face of the slit. At the same time, the columnar portion is moved along the slit, and the end face is heated to a temperature equal to or higher than the fusing temperature, with frictional heat that is generated due to friction between the circumferential surface and the end face during the move. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2008251947(A) 申请公布日期 2008.10.16
申请号 JP20070093138 申请日期 2007.03.30
申请人 MEIKO:KK 发明人 SEKI YASUAKI
分类号 H05K3/00 主分类号 H05K3/00
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