发明名称 CURABLE RESIN COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide a curable resin composition which is excellent in heat resistance, adhesion property, curability and moldability and comprises a thermoplastic resin and a soluble polyfunctional vinyl aromatic polymer having terminal phenolic hydroxyl groups, and a film, a resin-coated foil and a resin substrate obtained therefrom. SOLUTION: The resin composition comprises component (A): the soluble polyfunctional vinyl aromatic copolymer and component (B): the thermoplastic resin, provided that the component (A): the soluble polyfunctional vinyl aromatic polymer is obtained by copolymerizing a divinyl aromatic compound and a monovinyl aromatic compound, has phenolic hydroxyl groups derived from a polymerization additive on some of its ends and contains 10-90 mol% structural unit containing an unreacted vinyl group derived from the divinyl aromatic compound. The amounts of the component (A) and the component (B) compounded are 2-98 wt.% and 98-2 wt.%, respectively, against the total amount of the components (A) and (B). COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2008248001(A) 申请公布日期 2008.10.16
申请号 JP20070088599 申请日期 2007.03.29
申请人 NIPPON STEEL CHEM CO LTD 发明人 KITAJIMA HIROKO;KAWABE MASANAO
分类号 C08L25/00;B32B15/082;C08F12/00;C08L101/00;H05K1/03 主分类号 C08L25/00
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