发明名称 SPUTTERING TARGET
摘要 PROBLEM TO BE SOLVED: To provide a sputtering target which can reduce the production of both of particles originating in a nodule that occurs in an erosion part, and particles originating in a yellow powder that deposits on a non-erosion part, even if the size and the position of the erosion area changes to some extent. SOLUTION: The sputtering target is composed so as to make a region (erosion region) to be irradiated with ions cover the surface to be sputtered of the target, and also make the whole front face slightly bigger than the region to be irradiated with ions, and has a slope formed in between the surface to be sputtered and the side face of the target. The slope has its surface roughness which is larger than the surface roughness of the surface to be sputtered, and increases gradually from a side closer to the surface to be sputtered toward the side face of the target. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2008248346(A) 申请公布日期 2008.10.16
申请号 JP20070093335 申请日期 2007.03.30
申请人 TOSOH CORP 发明人 UCHIUMI KENTARO;NAGASAKI YUICHI
分类号 C23C14/34;C23C14/08 主分类号 C23C14/34
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