| 摘要 |
PROBLEM TO BE SOLVED: To provide a copper alloy for electronic parts composed of a Cu-Ni-P based alloy having satisfactory hot workability and exhibiting high strength, high electric conductivity and high thermal conductivity without impairing its bending workability. SOLUTION: The high-strength and high-electric conductivity copper alloy having excellent hot workability, is a copper alloy having a composition containing, by mass, 0.50 to 1.00% Ni and 0.10 to 0.25% P so as to satisfy the ratio between the Ni content and the P content, Ni/P: 4.0 to 5.5, and 0.005 to 0.070% B,≤0.0050% O, and one or more selected from Fe, Co, Mn, Ti and Zr by≤0.05% in total, and the balance Cu with inevitable impurities, wherein regarding the sizes of the second phase grains, provided that the major axis is denoted as a and the minor axis is denoted as b, the second phase grains having a of 20 to 50 nm and the aspect ratio a/b of 1 to 5 occupy≥80% of the area ratio of all the second phase grains with the major axis a of≥5 nm included in the copper alloy. The copper alloy may optionally contain one or more selected from Sn and In by 0.01 to 1.0% in total. COPYRIGHT: (C)2009,JPO&INPIT
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