| 摘要 |
The present invention relates to a multi-band antenna and, more particularly, to a sub multi-band antenna, in which a planer conducting part, which has a plurality of protruding portions, is inserted into a depression, which is formed on the surface of a body part formed through injection molding using a mold having a specific shape to surround first and second wire members, and the fitting depression of a fastening part, which is formed through the cutting or die casting of a metal material, and to a sub-band built-in chip antenna, in which sub radiation patterns having a predetermined length are formed on the interior surface of a body part, which is formed through injection molding using a dielectric material or is formed of a layered substrate a dielectric material
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