| 摘要 |
The generation of a wire bonding defect is reduced in the semiconductor device in which semiconductor chips are laminated. A wiring substrate, the first memory chip by which face-up mounting is done via the first filmy adhesive on the wiring substrate, the second memory chip by which face-up mounting is done via the second filmy adhesive on the first memory chip, and the microcomputer chip by which face-up mounting is done via the third filmy adhesive on the second memory chip are included. Since the third filmy adhesive adhered to the microcomputer chip of the highest stage is the thinnest, at the time of wire bonding of the microcomputer chip, the influence to the ultrasonic wave and load of wire bonding by softening of a filmy adhesive which takes place with the heat can be reduced, and lowering of wire bonding property can be suppressed.
|
