PACKAGE, METHOD OF MANUFACTURING A PACKAGE AND FRAME
摘要
The package comprises a chip and a plurality of frame contact pads. The chip is attached to the frame contact pads in a die attach area with a die attach adhesive. The chips is coupled to frame contact pads outside the die attach area with connecting elements. The chip, the connecting elements and the frame contact pads outside the die attach area are anchored in an electrically insulating encapsulation. The frame contact pads each comprise a first patterned layer and a second patterned layer, which second layer has the surface that is exposed outside the encapsulation. At least a portion of the frame contact pads in the die attach area has a first patterned layer with a first pattern that comprises at least one flange/lead that is outside the second patterned layer when seen in perpendicular projection of the first layer on the second layer.
申请公布号
WO2008122959(A2)
申请公布日期
2008.10.16
申请号
WO2008IB51333
申请日期
2008.04.08
申请人
NXP B.V.;VAN GEMERT, LEONARDUS, A., E.;DONKER, MARCUS, F.