ELECTROSTATIC CHUCK AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To reduce the occurrence of defective to be formed on a surface to be attracted when various kinds of processing are executed using an electrostatic chuck in a state where an object to be attracted is kept at high temperature. SOLUTION: This electrostatic chuck 6 is provided with a dielectric layer 14, an electrode 13 for inducing electric charges on the surface of the dielectric layer 14 and a heater for heating the dielectric layer 14 to not less than 400°C. The electrostatic chuck 6 is further provided with an insulating member 20 in which a surface contacting the object to be attracted (semiconductor wafer 1) is mirror-finished. COPYRIGHT: (C)2009,JPO&INPIT