| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor chip inspection apparatus for reducing the size of the apparatus as a whole without arrangement of an optical system for focusing a region to be imaged, variously changing the shapes of the imaging plane of an imaging element, and realizing effective inspection without having to change the inspection resolution. SOLUTION: The semiconductor chip inspection apparatus includes an imaging optical system for imaging a semiconductor integrated circuit chip. At least a defect is inspected from an image of the semiconductor integrated circuit chip. An imaging element larger than the maximum field size formed by the imaging optical system is provided. The existence of at least a defect is inspected, by extracting a part of the image picked up by the imaging element. The range of extraction is determined so as to enable optimum inspection, from the size information of the semiconductor chip as the inspection object. COPYRIGHT: (C)2009,JPO&INPIT
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