PHOTOSENSITIVE RESIN COMPOSITION

摘要

This invention provides a photosensitive resin composition which is suitable as a buffer coat material and a rewiring layer in an LSI chip and can be cured in air by photopolymerization. The photosensitive resin composition comprises a photosensitive silicone containing a styryl group as a photosensitive group and a photopolymerization initiator having a specific structure. There are also provided a method for cured relief pattern formation using the photosensitive resin composition, and a semiconductor device comprising the cured relief pattern.