HIGH TEMPERATURE SOLDER MATERIALS

摘要

A solder material is formed utilizing a transient liquid phase sintering process, where a precursor material is first formed. The precursor material comprises a plurality of metal particles including a first metal having a first melting point temperature and a second metal having a second melting point temperature, the first melting point temperature being greater than the second melting point temperature. The precursor material is heated to a process temperature (T_p) that is greater than the second melting point temperature and less than the first melting point temperature, and the precursor material is isothermally held at the process temperature (T_p) for a preselected holding period so as to form a metal alloy material having a melting point temperature that is greater than the process temperature. The solder material can be used to bond two components together in a device specified for use at an application temperature (T_a), where T_a/T_p > 1.