发明名称 |
AN UNDERCOATING LAYER FORMULATION FOR NON-PLATABLE GRADE SUBSTRATE FOR ELECTROLESS METAL PLATING |
摘要 |
Described herein is a coating formulation for non-platable grade substrate prior to undergoing an electroless metal plating process. Said coating formulation comprises of a mixture of multifunctional based monomer and diphenylmetane- 4, 4-diisocyanate (MDI), said multifunctional based monomer has allyl group or alkyl group or vinyl group or ether group or ester group or methacrylate group or acrylate group or phthalate group or combination thereof but does not include multifunctional monomer having hydroxyl group. According to the present invention, the ratio of said multifunctional based monomer is less than or equal (<) to diphenylmetane-4, 4-diisocyanate (MDI). Said coating formulation is mixed in a vacuum chamber for about 30 minutes before being applied to the surface of a non-platable grade substrate. |
申请公布号 |
WO2008123767(A2) |
申请公布日期 |
2008.10.16 |
申请号 |
WO2008MY00029 |
申请日期 |
2008.04.08 |
申请人 |
UNIVERSITI SAINS MALAYSIA;MOHAMAD IBRAHIM, MOHAMAD, NASIR;SIPAUT, COSWALD, STEPHEN |
发明人 |
MOHAMAD IBRAHIM, MOHAMAD, NASIR;SIPAUT, COSWALD, STEPHEN |
分类号 |
C09D125/00;C08L75/08;C23C18/18 |
主分类号 |
C09D125/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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