| 摘要 |
In one embodiment, a printed circuit board (12) includes a plurality of insulating layers (26) in which an aperture is formed through some of the layers. A resistive plug (28) at least partially fills the aperture and contacts respective conductive members (18, 20, 30) at each end of the resistive plug to form a resistive via (24) that traverses partially through the printed circuit board. In another embodiment, a printed circuit board (12) includes a plurality of insulating layers (26) in which an aperture is formed through at least some of the layers. A dielectric plug (32) at least partially fills the aperture and contacts respective conductive members (18, 20, 34) at each end of the dielectric plug to form a capacitive via (26) that traverses at least partially through the printed circuit board. |
