LASER PROCESSING APPARATUS AND LASER PROCESSING METHOD

摘要

A laser processing apparatus (10) is provided with a laser oscillator (12), a laser processing head (16), an optical fiber (14) which transmits a laser beam oscillated by the laser oscillator to the laser processing head, and an assist gas supply section (302) which supplies the laser processing head with oxygen in an assist gas. The optical fiber is provided with a removing section (30) for removing light which propagates in a clad or an attenuating section for attenuating such light. Light (36) leaked from the core (20) of the optical fiber (14) to a clad (122) is absorbed by a light absorber (34) of the removing section (30) or discharged to the external through a light transmitting member (38). Therefore, a cut surface of a metal which is cut by using the laser beam outputted from the processing head is a high quality surface without unevenness.