发明名称 THIN-FILM FORMING APPARATUS AND PLASMA GENERATION METHOD
摘要 <P>PROBLEM TO BE SOLVED: To provide a thin-film forming apparatus which evenly forms a film on a substrate of large area, and also to provide a plasma generation method therefor. <P>SOLUTION: The thin-film forming apparatus forms a thin-film on the surface of a substrate by using plasma. It comprises: at least two electrodes arranged to face the surface of substrate; a substrate supporting member which is arranged on the opposite side to the electrode through the substrate, for generating plasma with the electrode; at least one high-frequency power source for supplying a high-frequency voltage to the electrode; and at least one phase shifter for reversing the phase of the electrode applied to the adjoining electrode. The distances between the adjacent electrodes are such values as to generate no discharge between them, and also to be almost equal. <P>COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2008251682(A) 申请公布日期 2008.10.16
申请号 JP20070088752 申请日期 2007.03.29
申请人 MITSUBISHI HEAVY IND LTD 发明人 IYOMASA ATSUHIRO;YAMAKOSHI HIDEO;SATAKE KOJI
分类号 H01L21/205;C23C16/509;C23C16/54;H05H1/46 主分类号 H01L21/205
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