| 摘要 |
PROBLEM TO BE SOLVED: To provide manufacturing method of a laminated wiring board, capable of materializing secure via-hole connection excellent in reliability, even if an outer layer is laminated by the bonding layer of different materials. SOLUTION: The manufacturing method of a build-up multilayer wiring board comprises a step for laminating a bonding layer, an outer insulating layer, and an outer conductive layer on a surface having the conductive wiring circuit pattern in the inner circuit board so as to cover a part or all of the conductive wiring circuit pattern in the inner circuit board; forming at least the outer conductive layer, the outer insulating layer, and the bonding layer in reference to the alignment mark of the inner circuit board to form a plurality of via-holes; simultaneously, performing removal of burrs generated in the boring operation, and cleaning operation inside the via-hole; electrically connecting the conductive wiring of the inner circuit board with the outer conductive layer through the conductive layer in the via-hole; and forming the conductive wiring circuit pattern from the outer conductive layer. COPYRIGHT: (C)2009,JPO&INPIT |
