| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin molding having a smaller thickness and a flat back surface. SOLUTION: The resin molding 10 has a first resin layer 14 having an outer shell portion 18 including a space and a second resin layer 16 composed of a photo-curable resin 60 to overlie the back surface of the first resin layer 14 so as to fill the space. The second resin layer 16 is formed by applying the photo-curable resin 60 in an unhardened state to the back surface of the first resin layer 14, adhering a release material 62 having a flat surface to the back surface of the photo-curable resin 60, irradiating the photo-curable resin 60 with light to harden the photo-curable resin 60 and releasing the release material 62 from the hardened photo-curable resin 60 in order to flatten the surface of the second resin layer 16. COPYRIGHT: (C)2009,JPO&INPIT |
