| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component which can make its profile further smaller and its size further smaller. SOLUTION: An electronic component 11 comprises an electronic component element 8 mounted on a base substrate 7. The electronic component element 8, which is a surface acoustic wave element, is airtight sealed with the base substrate 7 and a metal cap comprising a lid member 2 and a frame-shaped sidewall 4. The metal cap has the lid member 2, made of metal foil and the frame-shaped sidewall 4 formed on one side of the lid member 2 through electrolytic plating. COPYRIGHT: (C)2009,JPO&INPIT
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