| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a circuit component which improves productivity and enables down-spacing within an electronic device. SOLUTION: Regarding a method of manufacturing a circuit component for manufacturing the circuit component comprising a wiring pattern on a surface of a resin mold, while abutting a member 21 to a resin mold 1 including a plated area to which a plating catalyst is applied, the member 21 covering the plated area while remaining a void 34 and comprising two openings 33a and 33b respectively linking the void and the outside, a plating liquid 22 is supplied from one opening 33a through the void to the other opening 33b, thereby forming a wiring pattern 3 constituted of a plating film in the plated area. COPYRIGHT: (C)2009,JPO&INPIT
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