发明名称 SUBSTRATE HEAT TREATMENT APPARATUS
摘要 PROBLEM TO BE SOLVED: To miniaturize a substrate heat treatment apparatus in the height direction. SOLUTION: The substrate heat treatment apparatus 1 has a casing 10 in a double-wall structure that surrounds a hot plate 16. A discharge nozzle 20 for discharging heated air into space in the casing 10 is integrally assembled to a top wall 14 in the casing 10. On the lower surface of the top wall 14, a guide plate 26 is provided which allows the heated air to flow along the top wall 14 by guiding the heated air discharged from the discharge nozzle 20. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2008251862(A) 申请公布日期 2008.10.16
申请号 JP20070091773 申请日期 2007.03.30
申请人 DAINIPPON SCREEN MFG CO LTD 发明人 NAKANE SHINGO
分类号 H01L21/027 主分类号 H01L21/027
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