METHOD FOR CLEANING SEMICONDUCTOR WAFER SURFACES BY APPLYING PERIODIC SHEAR STRESS TO THE CLEANING SOLUTION
摘要
<p>Systems and methods for cleaning particulate contaminants adhered to wafer surfaces are provided. A cleaning media including dispersed coupling elements suspended within the cleaning media is applied over a wafer surface. External energy is applied to the cleaning media to generate periodic shear stresses within the media. The periodic shear stresses impart momentum and/or drag forces on the coupling elements causing the coupling elements to interact with the particulate contaminants to remove the particulate contaminants from the wafer surfaces.</p>
申请公布号
WO2008123945(A1)
申请公布日期
2008.10.16
申请号
WO2008US04033
申请日期
2008.03.27
申请人
LAM RESEARCH CORPORATION;FREER, ERIK, M.;DE LARIOS, JOHN, M.;RAVKIN, MICHAEL;KOROLIK, MIKHAIL;REDEKER, FRITZ, C.
发明人
FREER, ERIK, M.;DE LARIOS, JOHN, M.;RAVKIN, MICHAEL;KOROLIK, MIKHAIL;REDEKER, FRITZ, C.