| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device capable of increasing the transmission rates of signals among a plurality of semiconductor chips. <P>SOLUTION: A wiring board 11 has the first to third semiconductor chips 12 to 14 having electrode pads 61A to 63A for the signals and being formed in a square shape in a plan view and a bus line 51 mounting the first to third semiconductor chips 12 to 14 and being electrically connected to the electrode pads 61A to 63A for the signals. In the semiconductor device 10, the electrode pads 61A to 63A for the signals are fitted at the corner sections 12A to 14A of the first to third semiconductor devices 12 to 14. In the semiconductor device 10, the corner sections 13A, 14A of the second to third semiconductor chips 13 and 14 are arranged near the corner sections 12A of the first semiconductor chip 12 arranged to the wiring board 11 while the electrode pads 61A to 63A for the signals are connected in serial to the bus line 51. <P>COPYRIGHT: (C)2009,JPO&INPIT |
