| 摘要 |
PROBLEM TO BE SOLVED: To provide a process for producing a mutilayer printed wiring board in which a recess above the through hole of an insulating layer to be formed is controlled in a method for forming the insulating layer by filling the through hole with an adhesive film and, at the same time, laminating the surface of a substrate. SOLUTION: The process for producing a mutilayer printed wiring board with an adhesive film having a resin composition layer of a thermosetting resin composition formed on a support includes (1) a step for touching the resin composition layer of the adhesive film onto a substrate having a through hole, hot pressing and laminating the adhesive film by a vacuum laminator under a reduced pressure and filling the through hole simultaneously, (2) a step for forming an insulating layer by thermosetting the thermosetting resin composition while touching the glossy surface of a metal foil having a thickness of 20μm or above, (3) a step for removing the metal foil after thermosetting, (4) a step for roughening the surface of the insulating layer with an oxidizing agent, and (5) a step for forming a conductor layer on the roughened surface of the insulating layer by plating. COPYRIGHT: (C)2009,JPO&INPIT |
