| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor laser element which can improve the planarity of cleavage plane of a waveguide. SOLUTION: The semiconductor laser element comprises a support substrate 1, a semiconductor laser element portion 50, having a pair of resonator surfaces 60 provided with the end portion 80a of a waveguide 80 extending in the direction B, and a solder layer 14 for bonding the support substrate 1 and the semiconductor laser element portion 50. In the vicinity of the resonator surface 60, the solder layer 14 has an air gap portion 70, formed in a region near the end portion 80a of the waveguide 80. In the vicinity of the resonator surface 60, the support substrate 1 and the semiconductor laser element portion 50 are bonded via the adhesive layer 14 in other than the region near the end portion 80a of the waveguide 80. COPYRIGHT: (C)2009,JPO&INPIT
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