| 摘要 |
PROBLEM TO BE SOLVED: To provide a high-reliability thin-film component and its manufacturing method. SOLUTION: A thin-film component is exposed to resin layers 9, 9A on a substrate 1, being projecting from the lateral sides to the outside. That is, a terminal electrode body 8 is not covered by the resin layers 9, 9A. An electronic device is protected by insulating layers 9, 9A, and the terminal electrode body 8 and the electronic device are electrically connected with each other. When an electrical signal is applied to the terminal electrode body 8, therefore, the electrical signal can be transferred to the electronic device. The terminal electrode body 8 as well as a boundary A between the terminal electrode body 8 and the resin layer 9 is covered by a cladding layer 10. COPYRIGHT: (C)2009,JPO&INPIT
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