| 摘要 |
PROBLEM TO BE SOLVED: To reduce fluctuation in size of a metal resistance element by preventing generation of standing waves within a resist film, during exposure in the photomechanical process technology for defining a forming position of the metal resistance element. SOLUTION: An underlayer insulating film 23 of the metal resistance element 27 is provided, in the longitudinal direction of the metal resistance element 27, with a curving plane projected upward, to occupy 40% or more of the upper plane between connecting holes 25, 25 of the metal resistance element 27. The metal resistance element 27 is provided with contacts and a curving plane, projected upward to occupy 40% or more of the upper and lower planes among contacts due to the curving planes of the underlayer insulating film 23 in the longitudinal direction of the same element. Since the reflected light of the exposing light is scattered by the curving planes, at the upper and lower planes of a metal film to form the metal resistance element 27 at exposure in the photoengraving technique to define the forming position of the metal resistance element 27, generation of the standing waves, in the resist film due to the reflected light and incident light, can be prevented. COPYRIGHT: (C)2009,JPO&INPIT
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