发明名称 Laser Processing Method and Device
摘要 A laser processing method which can efficiently perform laser processing while minimizing the deviation of the converging point of a laser beam in end parts of an object to be processed is provided. This laser processing method comprises a displacement acquiring step (S 06 and S 07 ) of acquiring a displacement between a point on the line to cut and one end of the line to cut in the object while irradiating the object with a second laser beam, converged by a lens, for measuring the displacement of a main surface of the object; and a position setting step (S 08 and S 09 ) of setting an initial position for holding the lens with respect to the main surface of the object according to the acquired displacement, and holding the lens at thus set initial position. After a modified region is formed in one end part of the line to cut by irradiation with a first laser beam for processing while holding the lens at the initial position, the lens is released from being held, and then the modified region is formed while adjusting the position of the lens.
申请公布号 US2008251506(A1) 申请公布日期 2008.10.16
申请号 US20040585660 申请日期 2004.12.13
申请人 发明人 ATSUMI KAZUHIRO;KUNO KOJI;KUSUNOKI MASAYOSHI;SUZUKI TATSUYA
分类号 B23K26/00;B23K26/04;B23K26/02;B23K26/03;B23K26/40;B23K101/40;H01L21/301 主分类号 B23K26/00
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