FUNCTIONAL ELEMENT PACKAGE AND FABRICATION METHOD THEREFOR

摘要

A functional element package is provided which includes a silicon substrate (41a) with a functional element having one of a mobile portion (42) and a sensor thereon; a seal member (43) being bonded with the silicon substrate (41a) to airtightly seal the functional element and form an airtightly sealed space (43a) therein, and including a step portion (43c) in its height direction; a first wiring portion (44) being connected with the functional element and extending from the airtightly sealed space (43a) to an outside thereof; a second wiring portion (46) being different from the first wiring portion (44) and extending from the step portion (43c) to an upper surface (43') of the seal member (43); and a bump (48) on the second wiring portion (46) on the upper surface of the seal member (43), in which the first wiring portion (44) extending in the outside is bent towards the airtightly sealed space (43a) and connected via a photoconductive member with the second wiring portion (46) on the step portion (43c).