| 摘要 |
<p>Disclosed is a Cu-Ni-Si-Co-based alloy reduced in the production of a coarse second phase particle. In the process for producing a Cu-Ni-Si-Co-based alloy; (1) the hot rolling is carried out after heating at 950 to 1050°C for 1 hour or longer, and the hot rolling termination temperature is fixed at 850°C or higher, and the cooling is carried out at a rate of 15°C/s or more; and (2) the solution treatment is carried out at 850 to 1050°C, and the cooling is carried out at a rate of 15°C/s or more. Specifically disclosed is a copper alloy for an electronic material, which comprises 1.0 to 2.5 mass% of Ni, 0.5 to 2.5 mass% of Co and 0.30 to 1.20 mass% of Si, with the remainder being Cu and unavoidable impurities. The copper alloy contains no second phase particle having a particle diameter greater than 10 µm, and contains a second phase particle having a particle diameter of 5 to 10 µm at a density of 50 particles/mm<SUP>2</SUP> or less in a cross-section parallel to the rolling direction.</p> |
