发明名称 RESIN COMPOSITIONS AND FILAMENTS
摘要 <p>There is provided a resin composition comprising a high density polyethylene, an ethylene-based polymer to which an insect-controlling agent is highly migratory, and an insect-controlling agent, the use of the resin composition for shaping filaments being effective to decrease the filament-cutting frequency in process of shaping the filaments. The resin composition comprises a high density polyethylene, a high-pressure-processed low density polyethylene, an insect-controlling agent and a support, wherein the melt flow rate (MFR) of the high density polyethylene is from 0.1 to 10 g/10 mins.; the high pressure-processed low density polyethylene satisfies the following conditions (a1) and (a2): (a1) the melt flow rate (MFR) is from 5 to 50 g/10 mins., and (a2) the proportion of a component having a molecular weight of 1,000,000 or more is from 1 to 12% by weight; and the content of the high-pressure-processed low density polyethylene is from 1 to 10 parts by weight, the content of the insect-controlling agent, from 0.1 to 15 parts by weight, and the content of the support, from 0.1 to 20 parts by weight, per 100 parts by weight of the high density polyethylene.</p>
申请公布号 WO2008123593(A1) 申请公布日期 2008.10.16
申请号 WO2008JP56725 申请日期 2008.03.28
申请人 SUMITOMO CHEMICAL COMPANY, LIMITED;EJIRI, SUSUMU 发明人 EJIRI, SUSUMU
分类号 C08L23/04;C08K3/00;C08K5/00;D01F6/46 主分类号 C08L23/04
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