| 摘要 |
<P>PROBLEM TO BE SOLVED: To reduce the occurrence of poor connection due to warpage of a semiconductor device by suppressing warpage occurring in the semiconductor device. <P>SOLUTION: An MCM 10 is provided with a plurality of semiconductor chips 11, 12, and 13 and a circuit substrate 14 having an almost rectangular outer shape. The MCM has an MCM type package structure in which a plurality of the semiconductor chips 11, 12, and 13 are arranged in parallel on a semiconductor-chip mounting face of the circuit substrate 14, and also, the semiconductor-chip mounting face is covered by a sealing resin 15 along the outer edge of the circuit substrate 14 in order to seal a plurality of the semiconductor chips 11, 12, and 13. The semiconductor chip 11 is mounted across a center line C that a longitudinally split face L, bisecting the semiconductor-chip mounting face with respect to the longitudinal direction, intersects with a laterally split face S bisecting the semiconductor-chip mounting face with respect to the lateral direction. A thickness, in a direction perpendicular to the semiconductor-chip mounting face, of the semiconductor chip 11 is larger than that of each of the other semiconductor chips 12, 13 mounted onto the semiconductor-chip mounting face. <P>COPYRIGHT: (C)2009,JPO&INPIT |
