发明名称 INSPECTION SUBJECT TRANSFER DEVICE AND INSPECTION APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a semiconductor wafer transfer device which puts a semiconductor wafer having undergone a low-temperature inspection, back to a temperature state for preventing dew condensation of the wafer in a short period of time, and enables supply of the next semiconductor wafer for a smooth low-temperature inspection even if a low-temperature inspection time is reduced. SOLUTION: The wafer transfer device 17 includes an arm storage chamber 17E having a gate 17F through which a transfer arm 17A comes in and out. The arm storage chamber 17E is provided with a gas supply means 23 having gas jet outlets 23A that supply dry air from different locations and a third pipeline 23G. Dry air is supplied from the gas jet outlet 23A toward a semiconductor wafer W that is transferred by the transfer arm 17A into the arm storage chamber 17E. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2008251678(A) 申请公布日期 2008.10.16
申请号 JP20070088710 申请日期 2007.03.29
申请人 TOKYO ELECTRON LTD 发明人 OBIKANE TADASHI
分类号 H01L21/677;H01L21/66 主分类号 H01L21/677
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