HEAD MODULE, LIQUID EJECTION HEAD, LIQUID EJECTOR, AND MANUFACTURING METHOD FOR HEAD MODULE

摘要

PROBLEM TO BE SOLVED: To improve a productivity and an assembling efficiency of a head module and a line head by reducing the number of parts. SOLUTION: A buffer tank 40 for forming a common channel which communicates with all ink liquid chambers of a head chip 20 is equipped with a hollow common channel forming part 41 that has one surface side opened, a head chip supporting part 43 for supporting the head chip 20 within an opening plane of the common channel forming part 41, and a wiring substrate supporting part 44 for supporting a flexible wiring substrate 30 that covers the opening plane of the common channel forming part 41. The head chip 20 is supported by the head chip supporting part 43 so that each ink liquid chamber and the common channel communicate with each other. The flexible wiring substrate 30 is supported by the wiring substrate supporting part 44 to form the common channel between the common channel forming part 41 and itself. COPYRIGHT: (C)2009,JPO&INPIT