| 摘要 |
<P>PROBLEM TO BE SOLVED: To improve through-put of a CMP device and to reduce a down-time. <P>SOLUTION: This polishing device is constituted to make a first dresser 8 and a second dresser 9 on the bottom surfaces of which diamond abrasive grains are fixed respectively, autorotate on a polishing pad 5 so as to reproduce and treat the polishing pad 5 before and after polishing and working a wafer by pushing it on the rotating polishing pad 5 by a polishing head 1. <P>COPYRIGHT: (C)2009,JPO&INPIT |
