发明名称 HIGHLY INTEGRATED WAFER BONDED MEMS DEVICE WITH RELEASE-FREE THIN MEMBRANE MANUFACTURE METHOD FOR HIGH DENSITY PRINT HEAD
摘要 PROBLEM TO BE SOLVED: To provide an MEMS electrostatic type inkjet printing head wherein an electrostatic thin membrane and a driver electrode are fabricated on separate wafers prior to bonding the wafers together in the inkjet printing head. SOLUTION: The MEMS type inkjet printing head is provided with a driver component 110, an MEMS component 112 which is fabricated separately from the driver component 110, including an aperture-free fluid thin membrane, a bonding feature 332 which operatively joins the driver component 110 and the MEMS component 112, and a nozzle plate 114 attached to the MEMS component 112. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2008247031(A) 申请公布日期 2008.10.16
申请号 JP20080075885 申请日期 2008.03.24
申请人 XEROX CORP 发明人 NYSTROM PETER J;GULVIN PETER M;BROWNE PAUL W
分类号 B41J2/045;B41J2/055;B41J2/16;B81B3/00 主分类号 B41J2/045
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