发明名称 RADIATION CURING RESIN COMPOSITION FOR COVERING ELECTRIC WIRE
摘要 PROBLEM TO BE SOLVED: To provide a resin composition for covering electric wire, especially telephone line cable, electric wire for connection between electronic instruments or in an electronic instrument. SOLUTION: The radiation curing resin composition for covering electric wire contains components (A), (B), (C) and (D). (A): urethane methacrylate which is a reaction product of polyol, polyisocyanate, and hydroxyl group-containing methacrylate; (B): a compound having a cyclic structure and one ethylene unsaturated group; (C): 0-5 mass% of compound having two or more ethylene unsaturated groups; and (D) polyol having an average molecular weight of 1,500 or more. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2008251435(A) 申请公布日期 2008.10.16
申请号 JP20070093390 申请日期 2007.03.30
申请人 JSR CORP;DSM IP ASSETS BV 发明人 YAMAGUCHI CHIYUUSHI;KAMO OSAMU;KUROSAWA TAKAHIKO
分类号 H01B7/17;C08F290/06;H01B3/44 主分类号 H01B7/17
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