发明名称 |
Solid state device and light-emitting element |
摘要 |
A solid-state device having: a flip-chip mounted solid-state element; a power receiving/feeding portion having a mounting substrate to allow that a mounting surface of the solid-state element forms substantially the same plane as a surface of the mounting substrate; and an inorganic sealing portion made of an inorganic sealing material having a thermal expansion coefficient equal to that of the power receiving/feeding portion for sealing the solid-state element.
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申请公布号 |
US2008252212(A1) |
申请公布日期 |
2008.10.16 |
申请号 |
US20080155820 |
申请日期 |
2008.06.10 |
申请人 |
TOYODA GOSEI CO., LTD. |
发明人 |
SUEHIRO YOSHINOBU;ICHIKAWA MASAYOSHI;WADA SATOSHI;TASUMI KOJI |
分类号 |
H01J1/88;H01L33/08;H01L33/38;H01L33/48;H01L33/56 |
主分类号 |
H01J1/88 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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