发明名称 REMOVING METHOD OF SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To provide a removing method of a substrate capable of easily and surely removing the substrate from on the stage while preventing the breakage of the substrate. SOLUTION: In this removing method of the substrate, the blowing process for blowing a gas to the surface of the substrate 1 on the stage 20 side and making the gas abut that surface after terminating the holding state of the substrate 1 realized by a holding means 30 for holding the substrate 1 on the stage 20, and the stopping process for stopping the blowing of the gas realized in the blowing process are repetitively carried out to remove the substrate 1 from on the stage 20. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2008251749(A) 申请公布日期 2008.10.16
申请号 JP20070089871 申请日期 2007.03.29
申请人 SEIKO EPSON CORP 发明人 MOMOSE SHINYA;OTA MUTSUHIKO;YAMAOKA TAKUSANE
分类号 H01L21/683;H01L21/027;H01L21/285;H01L21/3065 主分类号 H01L21/683
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