| 摘要 |
PROBLEM TO BE SOLVED: To provide a release film which has upgraded releasability from a caul, compared with a conventional release film which is unsatisfactory in such a releasability, while maintaining characteristics such as an excellent releasability from a circuit substrate, shape follow-up, uniform moldability, plating grab, FPC finish appearance creases, and a manufacturing method of a circuit substrate using this release film. SOLUTION: This release film has an emboss and is used in the circuit substrate pressing process. The surface coarseness (Rz: 10-point average coarseness) of the emboss of the release film is not less than 5μm to not more than 20μm before the pressing process, and not less than 2μm to not more than 8μm after the pressing process. In addition, the crystallization temperature of the resin constituting the release surface of the release film is higher than the pressing temperature of the pressing process of the circuit substrate. COPYRIGHT: (C)2009,JPO&INPIT |
